➀ EV Group announced the expansion of its management board to further strengthen its position in the semiconductor industry. ➁ Alexander Rank joins as Executive Corporate Functions Director, responsible for finance, purchasing, and human resources. ➂ EVG has seen consistent growth, investing in development and production capacities, and has recently opened its Manufacturing VI facility.
Recent #Hybrid bonding news in the semiconductor industry
➀ Hybrid bonding is gaining attention in advanced packaging for its ability to provide the shortest vertical connections between chips with similar or different functions, as well as better thermal, electrical, and reliability results.
➁ Despite some chip manufacturers adopting hybrid bonding in large-scale manufacturing, the high cost of the process makes it unsuitable for mass adoption. Challenges include better copper dimple uniformity, faster wafer-to-chip placement, and better alignment, multiple bonding and debonding carriers (which increase costs), and low-temperature annealing capabilities.
➂ The development of AI chips and modules is a significant driver for hybrid bonding and advanced packaging. High-performance and high prices of these chips help to drive industry development.